Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

NEN-IEC 62047-38 specifies a test method for measuring the adhesion strength of metalpowder paste in the electrical interconnection between micro-electromechanical systems(MEMS) and a circuit board. The typical examples of metal powder paste are anisotropicconductive paste, solder paste, and nanoscale metallic inks. This testing method is valid formetal powder diameters from 10 μm and 500 μm. In this test method, a uniaxial compression load is applied to metal powder paste using aglass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzedby considering the actual contact area between the MEMS device and metal powder particles