Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
| Standard Number | GB/T 19922-2005 |
|---|---|
| Organization |
Standardization Administration of China
|
| Level | National |
| Category | Test Method | Characterization | Measurement |
| Status |
|
ABSTRACT
This standard specifies the capacitive displacement sensing method for the determination of local flatness of the wafer surface method. This standard applies to non-contact, non-destructive measurement of dry, clean the surface of the semiconductor wafer local flatness. For more than 100mm in diameter and thickness of 250��m and above corrosion, polished and epitaxial wafers.