Researchers employ novel nanoprocessing method to achieve damage-free multi-point hole drilling in a graphene film

Earlier this year, Tohoku University researchers created a technique that could micro/nanofabricate silicon nitride thin devices with thicknesses ranging from 5 to 50 nanometers. The method employed a femtosecond laser, which emitted extremely short, rapid pulses of light. It turned out to be capable of quickly and conveniently processing thin materials without a vacuum environment.