New Nanopositioning and Ultra-Precision Motion Control Systems for Semiconductor Test and Manufacturing featuring at 2023 Semicon West

San Francisco, CA – PI’s booth #5678 at the 2023 Semicon West will feature a new high precision multi-axis wafer stage along with air bearing stages for wafer stealth dicing, precision direct-drive gantry stages, and high speed beam steering systems for laser beam delivery. For applications such as surface metrology, fast focus stages are available with a choice of piezo and voice coil motors.