Next Generation Technologies for Semiconductor Failure Analysis

The continuous downscaling of semiconductor technology nodes imposes ever more stringent requirements on metrology and failure analysis tools. This webinar will discuss recent advances in the following tools for failure analysis: Energy dispersive spectrometry (EDS) ­– EDS on a scanning electron microscope (SEM) and transmission electron microscope (TEM) is a powerful tool to chemically characterize features at the nano-scale. Challenges do arise when pushing EDS to a spatial resolution often required for the analysis of semiconductor devices.