Intel, Samsung, and TSMC Demo 3D-Stacked Transistors

A vision for future processors with nearly double the density of transistors is beginning to take shape, now that all three advanced chipmakers have demonstrated CFETS, or complementary field-effect transistors. CFETs are a single structure that stacks both the types of transistors needed for CMOS logic. At the IEEE International Electron Devices Meeting this week in San Francisco, Intel, Samsung, and TSMC showed what progress they’ve made toward the next evolution in transistors.