Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics
Date | 12th, Sep 2018 |
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Source | Nanowerk - Nanotechnology Websites |
DESCRIPTION
Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating.