EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing
| Date | 3rd, Dec 2018 |
|---|---|
| Source | AZoNano - Nanotechnology Websites |
DESCRIPTION
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all new BONDSCALE™ automated production...