Eficient cost-effective cooling solution for high performance chips
Date | 29th, May 2018 |
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Source | Phys.org - Scientific News Websites |
DESCRIPTION
Imec, the world-leading research and innovation hub in nano-electronics and digital technology, today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level. This achievement is an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems.