Core technology for ultra-small 3-D image sensor
| Date | 8th, Feb 2019 |
|---|---|
| Source | Phys.org - Scientific News Websites |
DESCRIPTION
A KAIST research team developed a silicon optical phased array (OPA) chip, which can be a core component for three-dimensional image sensors. This research was co-led by Ph.D. candidate Seong-Hwan Kim and Dr. Jong-Bum You from the National Nanofab Center (NNFC).