Picosun's New Technology for Superior Process Quality

ESPOO, Finland, 29th August 2019 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, reports excellent results obtained with its next generation R&D PEALD (plasma-enhanced ALD) technology. PEALD enables deposition at low temperatures and of several materials that could not be deposited with thermal process only. The drawback of PEALD, however, is damage to the sample surface, caused by ion bombardment. Picosun’s solution to this is remote plasma method, where the plasma source is located high enough above the sample, and the reactive species hitting the surface are radicals, not high-energy ions.