Nanotechnology Now - Press Release: SET, Smart Equipment Technology, Introduces New Automatic Flip-Chip Bonder Dedicated to Device Production: Developed with CEA-Leti in IRT Nanoelec�s 3D Program, NEO HB Combines High Precision, Flexibility, and Short Cycle Time for Direct Hybrid Bonding
| Date | 22nd, Nov 2019 |
|---|---|
| Source | Nanotechnology Now - Nanotechnology Websites |
DESCRIPTION
SET, Smart Equipment Technology, the leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ p...