At VLSI 2020, CEA-Leti Demos New Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process

CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.