Solar-powered smart dust

Researchers demonstrate that dust-sized photovoltaic cells grown on silicon substrate can be heterogeneously integrated with other chiplets using a high-throughput wafer-level packaging process. The ability to integrate various nanoelectronic chiplets - such as processor, memory, and photovoltaics - in an industrial-scale wafer-level-packaging process, unlocks the potential of large-scale manufacturing of these compact integrated systems with high performance and ultralow cost.