Fabrication of flexible electronics improved using gold and water-vapor plasma
| Date | 22nd, Dec 2021 |
|---|---|
| Source | ScienceDaily - General News Websites |
DESCRIPTION
Researchers have developed a technique to improve the flexibility of ultra-thin electronics, such as those used in bendable devices or clothing. To do so, they used water-vapor plasma to directly bond gold electrodes fixed onto separate ultra-thin polymer films. This is a significance advance because the technique works without adhesives or high temperatures.