European Consortiums Advance Quantum Computing Tech: Week in Brief: 3/18/22

Semiconductor materials producer Soitec will establish a fabrication facility at its headquarters in Bernin, France. The facility will be used to produce Soitec’s SmartSic wafers developed at the Substrate Innovation Center at CEA-Leti, using Soitec’s SmartCut technology. The facility will support the company’s 300-mm silicon-on-insulator activities.