New metrological technique uses stress for nanotomography

Researchers from Skoltech and their colleagues in Russia and Spain have reported a proof-of-concept demonstration of a new radiation-safe method for mapping the internal structure and stress distribution in samples of materials at the nanoscale, with a resolution about 100 times higher than that of the currently available techniques: X-ray and neutron tomography. The team believes that its 3D stress nanotomography could eventually become a standard metrological technique for nanotechnology. The study came out in the Journal of the Mechanics and Physics of Solids.