Nanotechnology Now - Press Release: ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements: Ultra Fn A Furnace Tool Shipped to China-Based Foundry Customer

ACM Research, Inc. (ACM), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool. The Ultra Fn A system adds thermal atomic layer deposition (ALD) to ACM’s extensive list of supported furnace applications. The company also announced that it has shipped the first Ultra Fn A furnace tool to a top-tier China-based foundry manufacturer. The product is expected to be qualified in 2023.