Chiplet integration technology with simplest scheme Scalability of inter-chip bandwidth and integration scale
| Date | 5th, Oct 2022 |
|---|---|
| Source | Tokyo Institute of Technology - Organizations and Universities Websites |
DESCRIPTION
Developed chiplet integration technology with excellent broadband chip-to-chip communication and scalable integration. Developed chiplet integration technology with novel silicon bridge architecture that uses fine "MicroPillar" and a manufacturing process called "All Chip-last". Highly versatile chiplet integration technology will accelerate the evolution of future semiconductor integrated circuit system technology instead of miniaturization, which is predicted to slow down.