Researchers develop graphene-nanowire 'sandwich' thermal interface for better electronics

Researchers from Carnegie Mellon University and MIT have demonstrated a 3D graphene-nanowire “sandwich” thermal interface that enables an ultralow thermal resistance of ∼0.24 mm2·K/W that is about 1 order of magnitude smaller than those of solders and several orders of magnitude lower than those of thermal greases, gels, and epoxies. Image In addition, the new 3D graphene-nanowire “sandwich” thermal interface also boasts a low elastic and shear moduli of ∼1 MPa like polymers and foams. It exhibits excellent long-term reliability with >1000 cycles over a broad temperature range from −55 °C to 125 °C. This nanostructured thermal interface material can greatly benefit a variety of electronic systems and devices by allowing them to operate at lower temperatures or at the same temperature but with higher performance and higher power density.