Printed, Hybrid, Structural & 3D Electronics

Topics:

 

- TechBlick Introduction

- IDENTIV - NFC & UHF Flexible & Hybrid Sensor Tags

- Smooth & Sharp - Printed RFID inlay in Mass Production Scale as basis for further FHE product

- CPI - Applications Utilising Roll to Roll Fexible Hybrid Electronics

- Enjet -High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics

- XTPL - High-Resolution 3D-Printed Conductive Features In Single Micron Scale

- US Army Research Lab - Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging

- CEA - Ultrathin Flexible ICs For Flexible Electronics

- Raynergy Tek - Innovations in Printed OPV Materials

- ARM - Towards Natively Flexible ICs

- Coatema - TBC

- SUNEW - OPV Production Scale-Up & Installation Challenge

- American Semiconductor -State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

- Texas Instruments - Semiconductor and Printed Electronics Industries: Overview of emerging applications

- Brilliant Matters -New Generation Of Photovoltaic Materials

= Parsons - Design & Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies

- Phillips 66 - Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics

- Ntrium - Recent EMI Shielding Process for Advanced Packaging

- Alpha Assembly -Ultralow Temperature Solder For Flexible Hybrid Electronics

- ACI Materials - ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

- CondAlign - Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

- Agfa/Nanogate - Printed Electronics made with Digital Printing: Materials and Application in Motor Sport

- Safi-Tech -Supercooled Fully Metallic FHE Interconnect Technology

- NovaCentrix - PulseForge Soldering – Using flash lamp technology for conventional solder alloy reflow

- VSParticle - Accelerating the development of new value added materials

- DuPont Teijin Films/Fraunhofer FEP - Advances in Polyester Film Substrates for Flexible Electronics

- C3Nano - Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

- Panasonic - Development of Stretchable, Conformable and Pliable Circuit Materials

- Metamaterial Inc (META) - The Dawn of Electro-Optics: Emerging Multi-functional and High-Performance Metamaterials

- Procter & Gamble/Coca-Cola - Panel Discussion - Smart & Intelligent Packaging

- Wuerth - Challenges & Opportunities of AM in Passive Electronic Industry – A Practical Approach on Materials, Designs an

- Signify - Hybrid manufacturing of 3D integrated electronics for LED lighting

- VTT - Roadmap Towards More Environmentally Friendly Electronics

- Prismade - Secure, invisible and green printed electronics. A journey from ID cards to gamification and to blockchain it

- Kimoto - Application of Flexible Light Diffusion Films in User Interfaces

- PolyIC - Smart HMI surfaces with inmolded touch sensors and decoration

- Kundisch - Applications using Printed and Hybrid Electronics in the HMI Industry

- Sheldahl - The Evolution or Revolution of the Human Machine Interface Market

- e2ip/ Nat Research Council of Canada- Molecular Ink applied to Printed & In-Mold Electronics

- Danish Technology Institute /ACCIONA - LEE-BED: Services and infrastructure within printed and embedded electronics

- Brewer Science - Printed Smart Devices: Enabling Widespread, Real-Time Sensing

- Applied Materials - Advanced screen printing for PE: two case studies of industrial applications in medical and display

- Hewlett Packard - HP’s 3D Printing of Electronics using Multi Jet Fusion

- IDS - NanoJet: The Next Generation in Aerosol Printing

- NanoOps -High-Throughput Wafer Printing of Nano and Microelectronics: A Fab in A Tool

- Airbus/Boeing - Panel Discussion - Opportunities & Challenges for Printed Hybrid Electronics in Aerospace