Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

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Standard Number BS IEC 62047-38:2021
Organization British Standards Institution UK
Level National
Category Test Method | Characterization | Measurement
Status
  • JUL 2021 Published