| Standard Number | PWI 113-181 |
|---|---|
| Organization |
International Electrotechnical Commission
|
| Level | International |
| Category | Specification |
| Status |
|
This part of IEC 62565 establishes a Blank Detail Specification (BDS) for • graphene thermal pad (GTP) used for • thermal interface materials (TIMs) of electronic devices, especially for high-power electronic components with high heat dissipation ratings, such as single chips, multi-chip modules, integrated circuits, etc.
