Test method of particles on silicon wafer surfaces

Test method of particles on silicon wafer surfaces

Standard Number GB/T 19921-2005
Organization Standardization Administration of China China
Level National
Category Test Method | Characterization | Measurement
Status
  • SEP 2005 Published
ABSTRACT
This standard specifies: Scanning Surface Inspection Systems (SSIS) polished surface of the silicon particles for testing, counting and reporting program. This standard applies to: polished silicon wafers, also apply to the silicon wafer or other mirror polished (compound polished). This standard also applies to the observed surface polished silicon wafers scratches, orange peel, pit, corrugated and other defects, But these flaws detection, classification depends on the device features, and with the detection initial settings.