Standard test methods for measuring site flatness on silicon wafers by noncontact scanning

Standard test methods for measuring site flatness on silicon wafers by noncontact scanning

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Standard Number GB/T 19922-2005
Organization Standardization Administration of China China
Level National
Category Test Method | Characterization | Measurement
Status
  • JAN 2005 Published
ABSTRACT
This standard specifies the capacitive displacement sensing method for the determination of local flatness of the wafer surface method. This standard applies to non-contact, non-destructive measurement of dry, clean the surface of the semiconductor wafer local flatness. For more than 100mm in diameter and thickness of 250��m and above corrosion, polished and epitaxial wafers.