DUBLIN--(BUSINESS WIRE)--The "Advancements in Silicon Photonics, Radio Frequency Transformers, Nanoparticles, and 3D Chips" report has been added to ResearchAndMarkets.com's offering.
This Microelectronics TOE profiles developments in silicon photonics, radio frequency transformers, nanoparticles, and 3D chips. Silica-based variable optical attenuator arrays, optical integration using silicon photonics integration platform, radio frequency transformers with 3D nested architecture, carbon nanotubes incorporated with gadolinium, and a multi-jet cooler for 3D chips are profiled in the TOE.
Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables.
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Key Topics Covered:
Silica-based Variable Optical Attenuator Arrays Optical Integration Using Silicon Photonics Technology Platform Radio Frequency Transformers with 3D Nested Architecture Carbon Nanotubes Incorporated with Gadolinium Multi-jet Cooler for 3D Chips Industry ContactsFor more information about this report visit https://www.researchandmarkets.com/research/tsgzcp/advancements_in?w=4
