Nanotechnology Now - Press Release: ULVAC Inc., and Oxford Instruments Plasma Technology collaborate to bring Atomic Scale Processing solutions to the Japanese Power and RF markets

'Oxford Instruments Plasma Technology is excited to be collaborating with ULVAC in order to bring its proven process solutions to the Japanese power and RF markets', commented Mike Gansser-Potts, Managing Director, Oxford Instruments Plasma Technology. 'This relationship, which will begin with ULVAC as our channel partner in Japan, will allow local production customers access to Oxford Instruments' suite of Atomic Scale Processing solutions'

'This is indeed a very significant collaboration', confirmed Tetsuya Shimada, General Manager for Advanced Electronics Equipment Division of ULVAC Inc., 'Our new collaborator, Oxford Instruments Plasma Technology, has critical process technology and know-how which complements our own capabilities. Combined with our customer support infrastructure this will allow us to provide a complete solution to our Japanese customers.'

Oxford Instruments Plasma Technology's Atomic Layer Deposition (ALD) and Atomic Layer Etch (ALE) are critical process steps for GaN and SiC based devices to enable functionality and reliable device manufacturing. With the critical know-how and expertise gained over the last ten years in Wide Band Gap applications, Oxford Instruments Plasma Technology is perfectly placed to serve the technology leading Japanese production customers in these markets.

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Issued for and on behalf of Oxford Instruments Plasma Technology

Contacts:Claire Critchell BA (Hons), ACIMMarketing Communications Manager

Oxford Instruments Plasma TechnologyNorth End, Yatton, Bristol BS49 4AP, UK Tel: +44 (0) 1934 837053