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Recent impressive advances in mass transfer techniques have proven to be a promising solution to overcome the extreme requirements of assembling microLED chips, including the laser lift-off technique, contact µTP technique, laser non-contact µTP technique and self-assembly technique.
Figure. l shows the simplified fabrication process of microLED displays (center part in Fig. 1) and representative applications that have been described above. Deterministic assembly of microLED chips from different growth/donor substrates is required. However, since the feature size of microLED chips is
Figure. l shows the simplified fabrication process of microLED displays (center part in Fig. 1) and representative applications that have been described above. Deterministic assembly of microLED chips from different growth/donor substrates is required. However, since the feature size of microLED chips is 