2020-12-16
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today introduced the EVG320 D2W die preparation and activation system -- the industry's first commercially available hybrid bond activation and cleaning system for die-to-wafer (D2W) bonding. The system incorporates all critical pre-processing modules needed for D2W...
