Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment. Part 3: Nano-scale wafer surface inspection method using UV light

This part of IEC xxxxx provides guidance on the use of optical inspection for detecting nano-scale defects on commercially available wafers using ultraviolet (UV) light.  Additionally, this document describes wafer defects detected by UV inspection techniques and various other surface characterization methods.

The scope of this document applies to all types of wafers currently employed for semiconductor devices.