A team of researchers affiliated with both the University of California–Berkeley and the Kavli Energy Nanoscience Institute at UC, has developed a new covalent organic framework (COF) using boron and phosphorus—one that allows for higher connectiv...
Oct 29, 2020
As progress in traditional computing slows, new forms of computing are coming to the forefront. At Penn State, a team of engineers is attempting to... The post Efficient Brain-Based Computing Using Graphene-Based Memory Resistors appeared first o...
Oct 29, 2020
It is currently challenging to directly observe the formation of intracellular nanostructures in the lab. In a new report, Miaomiao Zhang and a research team in chemistry, life sciences, medical engineering and science and technology, in China, us...
Oct 29, 2020
Researchers led by the University at Buffalo (UB) have devised a new method that could enhance the effectiveness of vaccines against the novel coronavirus, the virus that is responsible for causing...
Oct 29, 2020
A University at Buffalo-led research team has discovered a technique that could help increase the effectiveness of vaccines against the novel coronavirus, the virus that causes COVID-19. Jonathan F....
Oct 29, 2020
As progress in traditional computing slows, new forms of computing are coming to the forefront. A team of engineers is attempting to pioneer a type of computing that mimics the efficiency of the brain's neural networks while exploiting the br...
Oct 29, 2020
As progress in traditional computing slows, new forms of computing are coming to the forefront. At Penn State, a team of engineers is attempting to pioneer a type of computing that mimics the efficiency of the brain's neural networks while ex...
Oct 29, 2020
Engineers are attempting to pioneer a type of computing that mimics the efficiency of the brain's neural networks while exploiting the brain's analog nature.
Oct 29, 2020
Taiwan Semiconductor Manufacturing Company (TSMC) plans to expand extreme ultraviolet (EUV) lithography tools for its next-generation 3 nm (N3) node process. TSMC was the first company to use ASML’s EUV lithography machines for high-volume product...
Oct 29, 2020
Engineers at Michigan State University (MSU) have crafted a new type of liquid foam lining they say can help football helmets better sustain repeated impacts, improving their longevity and the safety of those wearing them. The material would also ...
Oct 29, 2020
